184_ MOTOROLA MPX7451RX667WE

Air-cooling fan could lean, but it was put horizontally until now.

Rotation frequency increased in order to start a turn with lower temperature, but undesired noise in weak rotation and is not worried because it became variable flow of two phases of strength and weakness.

Dimension of CPU is bigger than 25 mm sq. of 7410 as before by 29 mm sq.L3 cash interface should be carried, but there is neither the place carrying cash chip nor land.

185_ PowerBook G4 Gigabit Ethernet logic board

A central especially big chip is Uni-North IC.

It is assumed that I adopted 4* A GP and FSB of 133 MHz newly this time.

Gigabit Ethernet PHY was 88E1011 of ALASKA Ultra series of Maravell instead of Broadcom. One of the IC that integration is the highest with a chip carried by Logic Board.

186_ PowerBook G4 Gigabit Ethernet logic board

This is the backside. Total configuration was different from rev.A in Logic Board with rev.B.

Sound chip is changed in TLC320AD77C of Audio Codec of Tumbler Audio IC,TEXAS INSTRUMENTS company.

187_ Rev. A CPU Heat spreader

This is heat spreader of Rev A.

It use heat pipe and introduce a heat to occur from ATI Mobility 128, Uni-North IC, PowerPC 7410 into heat sink of the right side.

188_ Rev. A Main carbon frame

Carbon flame of Rev. A is flexible.

189_ Rev. B Heat Sink

The heat sink that it was beautiful to stand out immediately when a keyboard was removed from. I think of associating an air-cooled engine.

190_ Rev. B Heat Spreader and metal frame

Heat Spreder and Heat Sink which were looked at from the backside after removed Logic Board from.